Explore Inkbit Pack Studio, a revolutionary software for streamlined packaging and logistics planning in manufacturing.

Setting the standard for quality and creativity in the fast-growing custom packaging market ...

OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Engineered for high-mix production, the Somic 434 SuperFlex automated cartoning machine accommodates several package styles ...