Abstract: Aluminium to Aluminium (Al-Al) direct bonding is CMOS line compatible and is comparable to gold (Au) and copper (Cu) due to metal cross-contamination in a process line. The Au-Au and Cu-Cu ...

Feeling helpless? Learn how mothers can channel political rage into meaningful action that protects their children's futures.

3D Visual Grounding (3DVG) aims to locate objects in 3D scenes based on textual descriptions, which is essential for applications like augmented reality and robotics. Traditional 3DVG approaches rely ...

From the column: "We must ... pass a robust bonding bill that funds local projects, repairs aging infrastructure, and creates ...