Toshiba offers engineering samples of its TB9084FTG, a MOSFET gate driver IC for three-phase brushless DC (BLDC) motors.

The manufacturing landscape is being transformed, driven primarily by the rapid adoption of industrial automation.

Yokogawa's WT1800R power analyser aims to boost the efficiency of complex power measurement for new energy applications.

NeoCortec now offering customers the ability to license its NeoMesh wireless mesh networking protocol and software.

Siemens announces that it has established a host of new certifications for its recently introduced Solido SPICE software ...

Tower has announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering.

Valeo and ROHM Semiconductors are working together to develop and optimise the next generation of power modules.

TDK-Lambda brand CN-B110 power module series now includes 50W, 100W, and 150W rated quarter-brick DC-DC converters.

How AI can be used to address the complexity issue when designing the next generation of wireless systems and networks.

Murata's new series of HaLow modules (LBWA0ZZ2HK and LBWA0ZZ2HL) are compliant with Sub-1 GHz (S1G) Wi-Fi standards.

Peter Carlsson, the CEO and co-founder of Northvolt, quit the company last week and in doing so revealed that it needed a ...

Rocket Lab receives CHIPs Act funding to increase its compound semiconductor manufacturing capability and capacity.