The upper bar recalls tree trunks in its striated form, while the darker glass base mirrors the shadowed ground. The use of ...
Abstract: 2.5D glass interposer technology based on through glass via (TGV) becomes a hot research topic on account of good electrical property and CTE (coefficient of thermal expansion) mismatch [1].
Abstract: Through glass via (TGV) technology presents a promising alternative for 3-D vertical interconnects in advanced packaging. As device integration progresses, the number of through vias in ...
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